Optical Critical Dimension Metrology High Yield^® Competence Series

Suitable for measuring key dimensions of complex structures such as FinFET, VNAND, DRAM, and other cutting-edge technology nodes;
Used for measuring the microscale morphology of two-dimensional or three-dimensional samples in multiple process stages such as after development (ADI) and after etching (AEI), such as high-precision key dimensions such as sidewall height, depth, and width.